Vice President, Advanced Packaging

CONFIDENTIAL RETAINED SEARCH | US SEMICONDUCTORS

Search Reference: TNF-SC-PKG-2026 | Advanced Packaging Leadership Mandate, US Semiconductors

ABOUT THIS SEARCH

Top Notch Finders has been retained on an exclusive and strictly confidential basis to identify a VP of Advanced Packaging for a well-established organization in the United States semiconductor industry. To protect the interests of our client and of every candidate who engages with us, the identity of the company and the location of its operations are disclosed only to qualified candidates under a confidentiality agreement. All inquiries and applications are received and managed solely by Top Notch Finders.

THE OPPORTUNITY

The VP of Advanced Packaging leads the advanced-packaging technology roadmap, including 2.5D, 3D, and hybrid-bonding integration, and manages front-end/back-end process integration with OSAT and ecosystem partners.

MARKET CONTEXT

With high-bandwidth memory capacity effectively sold out industry-wide and most advanced packaging capacity concentrated in Asia, US chipmakers must secure specialized packaging leadership years before domestic facilities mature. AI accelerator and data-center chip demand is a direct driver of this need.

KEY RESPONSIBILITIES

• Define and execute the advanced-packaging technology roadmap across 2.5D, 3D, hybrid bonding, and panel-level packaging.
• Manage integration between front-end wafer processing and back-end packaging and test operations.
• Build and maintain strategic relationships with OSAT (outsourced assembly and test) partners and packaging ecosystem suppliers.
• Lead commercialization of packaging solutions from concept through high-volume manufacturing.
• Represent the company in industry packaging consortia and standards bodies.
• Collaborate with customers, including hyperscalers and AI accelerator designers, on custom packaging requirements.
• Manage packaging capital equipment planning and capacity allocation. 

REQUIRED QUALIFICATIONS AND EXPERIENCE

• 12+ years of experience in semiconductor packaging engineering or technology leadership.
• Deep engagement with Tier-1 foundry, IDM, and memory customers.
• Hands-on expertise in hybrid bonding, 2.5D/3D integration, and advanced substrate technologies.
• Track record of commercializing packaging solutions from concept to high-volume manufacturing.
• Experience leading industry-consortium or standards-body initiatives.
• Advanced degree in materials science, electrical engineering, or a related discipline preferred.

CONFIDENTIALITY AND HOW TO APPLY

This is a discreet, retained engagement. Your candidacy will never be presented to any organization without your explicit prior authorization, and no application will be visible to the hiring company at this stage. Accomplished packaging technology leaders are invited to submit a resume in confidence through the Top Notch Finders website. Please reference search code TNF-SC-PKG-2026 in your submission. Do not include export-controlled technical data or other proprietary information of any kind in your application materials. Only candidates whose backgrounds align closely with the mandate will be contacted.