Vice President, Advanced Packaging

  • Full Time
    • United States Semi Conductors

Website Top Notch Finders

Confidential executive search for the US semiconductor industry

CONFIDENTIAL RETAINED SEARCH | US SEMICONDUCTORS

We are conducting a confidential, retained search for an advanced packaging vice president at a well-established US semiconductor company. The VP will lead the advanced-packaging technology roadmap, including 2.5D, 3D, and hybrid-bonding integration. In addition, this executive will manage front-end and back-end process integration with OSAT and ecosystem partners. Therefore, we seek leaders with 12+ years of semiconductor packaging engineering or technology leadership.

Search Reference: TNF-SC-PKG-2026 | Advanced Packaging Leadership Mandate, US Semiconductors

ABOUT THIS SEARCH

Top Notch Finders holds an exclusive, strictly confidential retained search for a Vice President, Advanced Packaging at a well-established organization in the US semiconductor industry. To protect our client and every candidate, we disclose the company’s identity and the location of its operations only to qualified candidates under a confidentiality agreement. In addition, Top Notch Finders receives and manages every inquiry and application directly.

THE OPPORTUNITY

The VP of Advanced Packaging leads the advanced-packaging technology roadmap, including 2.5D, 3D, and hybrid-bonding integration. This executive also manages front-end and back-end process integration with OSAT and ecosystem partners. As a result, the role links wafer processing, packaging, and test operations with the company’s outside partners.

MARKET CONTEXT

High-bandwidth memory capacity has effectively sold out industry-wide, and most advanced packaging capacity sits in Asia. Because of this, US chipmakers must secure specialized packaging leadership years before domestic facilities mature. In addition, AI accelerator and data-center chip demand directly drives this need.

For a deeper look at how we evaluate and hire senior leaders in this industry, read our The 2026 San Diego Semiconductor Executive Search Hiring Guide. It also explains our approach to executive search for packaging and technology leadership roles.

KEY RESPONSIBILITIES

  • Define and execute the advanced-packaging technology roadmap across 2.5D, 3D, hybrid bonding, and panel-level packaging.
  • Manage integration between front-end wafer processing and back-end packaging and test operations.
  • Build and maintain strategic relationships with OSAT (outsourced assembly and test) partners and packaging ecosystem suppliers.
  • Lead commercialization of packaging solutions from concept through high-volume manufacturing.
  • Represent the company in industry packaging consortia and standards bodies.
  • Collaborate with customers, including hyperscalers and AI accelerator designers, on custom packaging requirements.
  • Manage packaging capital equipment planning and capacity allocation.

REQUIRED QUALIFICATIONS AND EXPERIENCE

  • 12+ years of experience in semiconductor packaging engineering or technology leadership.
  • Deep engagement with Tier-1 foundry, IDM, and memory customers.
  • Hands-on expertise in hybrid bonding, 2.5D/3D integration, and advanced substrate technologies.
  • Track record of commercializing packaging solutions from concept to high-volume manufacturing.
  • Experience leading industry-consortium or standards-body initiatives.
  • Advanced degree in materials science, electrical engineering, or a related discipline (preferred).

CONFIDENTIALITY AND HOW TO APPLY

This is a discreet, retained engagement. Therefore, we will never present your candidacy to any organization without your explicit prior authorization. In addition, the hiring company cannot see any application at this stage.

If you are an accomplished packaging technology leader and want to be considered as our next advanced packaging vice president, please submit your resume in confidence through the Top Notch Finders website. Also, reference search code TNF-SC-PKG-2026 in your submission. However, do not include export-controlled technical data or other proprietary information of any kind in your application materials. Finally, we will contact only the candidates whose backgrounds align closely with the mandate.

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